What is the difference between SMT surface mount and post soldering?

Date：2022-12-15 Views：

What is the difference between SMT surface mount and post soldering? In the electronic manufacturing industry, SMT surface mount and post soldering are two common surface assembly techniques. Although they are both methods used for soldering electronic components, there are some significant differences in their processes and applications. This article will introduce the differences between SMT surface mount processing and post soldering, helping readers better understand their differences and applicable scenarios. SMT is a process of directly installing electronic components on the surface of a PCB. Compared to traditional through-hole mounting technology, SMT has higher integration, smaller size, and lower cost. SMT chip factories use automated equipment to directly attach electronic components to the surface of PCBs and use melted solder to bond them together. This technology is widely used in electronic products such as smartphones, tablets, and televisions, and plays an important role in miniaturization, lightweighting, and high-frequency applications.

On the contrary, post soldering is a process of heating electronic components already installed on a PCB using a hot air stove and melting the solder to complete the soldering. Post welding is usually used in the manufacturing process of double-sided or multi-layer boards, with the main advantages of high welding strength, low contact resistance, and the ability to use larger size and higher power components. The post welding operation requires placing the assembled electronic components in a hot air furnace and completing the welding by controlling the temperature and time. After welding is completed, reliability testing is required to ensure that the welding quality meets the requirements. SMT surface mount processing and post soldering have significant differences in process. For SMT production, the first step is to automatically assemble components such as surface mount resistors and capacitors onto the PCB. Then, use a hot air stove to heat the entire PCB, melt the solder and solidify the components. Unlike this, post soldering requires manually or mechanically fixing the components to the PCB first, and then soldering through a hot air stove. Although post welding requires more manual operation, the welding reliability is higher because there is no movement of components during the welding process.

SMT patching and post soldering also differ in their applicable scenarios. Due to its ability to achieve high integration, SMT is suitable for the manufacturing of miniaturized, high-frequency, and high-performance electronic products. Then soldering is more suitable for assembling larger components and PCBs, such as power circuits, amplifiers, etc. In some special application scenarios, different welding techniques can also be combined to achieve better performance and reliability. In summary, SMT and post soldering are two common electronic component soldering techniques. They have some significant differences in craftsmanship and applicable scenarios.

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